Inertial MEMS and Microsystems
Dec 25,2024
FC Flip-Chip Pressure-Insulated Chip
● International Original
● Employs SOI bulk silicon TSV technology and wafer-level packaging technology.
● Leadless package, allowing direct contact with liquid media
HP High-Performance Differential Pressure Chip
● International Pioneering
● Employs silicon-to-silicon bonding, multiple dielectric isolation, and shielding technologies.
● Accuracy as high as 0.04%
SP Small Absolute Pressure Chip
● International Pioneering
● Uses platinum leads, resistant to corrosive media such as automotive exhaust gases.
● Approximately 30,000 chips per wafer
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