Ability
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- Time of issue:2019-07-11 00:00:00
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Description:
Information
MT Microsystems is one of the earliest founded and largest MEMS R&D center in China. We owns15000㎡ clean room with an 6-inch silicon-based MEMS processing line. We have serviced the customers for more than 10
years.
years.
MENU OF SERVICES
♦ Designing
We own advanced workstation and simulation software, such as ANSYS, L-Edit, CFD, HFSS, CANDENCE, etc.
♦ Processing
We owns 3000㎡ clean room with an 6-inch silicon-based MEMS processing line.
♦ Packaging
Metal Packaging
Ceramic Packaging
Vacuum Packaging
♦ Testing and calibration:
Wafer level testing with climate chamber
2D Rate table with climate chamber
Optical Dividing Head
Centrifuge
Network Analyzer
Vibrating Table
Shock test machine up to 50,000g
CAPABILITIES
Lithography
♦ Single-side lithography
♦ Double-side lithography
♦ Stepper
Dielectric Film
♦ Dry Oxidation
♦ Wet Oxidation
♦ Diffusion,
♦ LPCVD for low Stress SiNx, Poly-Si, SiO2, TEOS,
♦ PECVD for SiO2, SiNx, α-Si, PSG, Optical Waveguide and other thin film.
Metallization
♦ Sputtering
♦ E-Beam Evaporation
♦Electroplating
Wet Etching
♦ TMAH
♦ Deep Boron Diffusion Etch-Stop Technology
♦ BOE / HF
♦ Metal (Au, Cr, Ti, etc.) Etching
♦ Standard Cleaning Process.
Dry Etching
♦ RIE for SiO2, SiNx, Poly-Si, Si Etching,
♦ ICP for Si Deep Etching,
♦ FIB for Metal Etching, etc.
Wafer Bonding
Si-Glass, Si-Si, Au-Si, Pb-Sn, Au- Au
Cutting-Grinding-Polishing:
Silicon Chip, Glass Chip, Ceramic Chip:
♦ Dicing
♦ Cutting
♦ Grinding
♦ CMP
Inspection：
♦ SEM
♦ AFM
♦ Measuring Microscope
♦ α-Steper
♦ Profiler
♦ Ellipsometer
♦ Stress Tester
♦ Four-probe Tester
♦ Particle Detector
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