MEMS isolator

Product Features ● Frequency: 30–32 GHz ● Ultra-small volume ● MEMS process ● High power capacity ● Custom processing available upon request ● High precision and good consistency

+86-311-83933866

jl.dong@mtmems.com

Product Classification:

Radio Frequency (RF) MEMS Devices

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Product Introduction

The world’s first to launch a new-generation MEMS isolator fabricated using high-precision micro- and nano-scale 3D processing, image encapsulation, and TSV (Through-Silicon Via) MEMS technology, this product boasts an exceptional microwave performance with frequency coverage up to 40 GHz, featuring high power handling capability, ultra-low insertion loss, full shielding, and superior anti-interference characteristics. It offers a 50Ω microstrip/co-planar waveguide output and utilizes wire bonding for interconnection.

MEMS Isolator Selection Table

Performance metrics

Parameter Name	Symbol	Test conditions: Unless otherwise specified, -55 Celsius ≤ T _A≤85 Celsius f 30 GHz to 32 GHz, P _I =-10 dBm, Z ₀ =50Ω	Limit value		Unit
			Minimum	Maximum
Insertion loss	IL ₊	T _A =25 Celsius ；	–	0.5	dB
		T _A = Extreme temperature (-55) Celsius /85 Celsius )	–	0.6	dB
Isolation degree	ISO _–	T _A =25 Celsius ；	18	–	dB
		T _A = Extreme temperature (-55) Celsius /85 Celsius )	16	–	dB
Voltage Standing Wave Ratio	VSWR	T _A =25 Celsius ；	–	1.25	–
		T _A = Extreme temperature (-55) Celsius /85 Celsius )	–	1.40	–