Pressure chip

Pressure chip

Product Model:

HP

Product Features ● Small thermal zero drift ● Small temperature hysteresis ● Piezoresistive pressure sensor ● Excellent long-term stability


Performance Metrics

Unless otherwise specified, all of the following metrics were measured at 25°C with a 5V DC power supply.

ParametersMinTypicalMaxUnitNote
Measurement range---40k---Pa 
Bridge arm resistance4.75.76.7 
Zero-point output-500+ 50mV 
Full-scale output6090120mV 
Nonlinear00.200.30%FSO1
Hysteresis under pressure00.050.10%FSO1
Non-repetitive00.100.20%FSO1
TCR (Temperature Coefficient of Resistance of Bridge Arms)+0.09+0.11+0.13%R/℃2
TCS (Temperature Coefficient of Sensitivity)-0.23-0.2-0.17%FSO/℃2
TCO (Zero-Point Temperature Coefficient)-0.05±0.03+ 0.05%FSO/℃2
Temperature Hysteresis-0.2---+ 0.2%FSO2
Long-term stability-0.2---+ 0.2%FSO/year 
Positive Overload Pressure 5x Rated pressure 
Positive Burst Pressure 7x Rated pressure 
Backside Overpressure 3x Rated pressure 
Backside Rupture Pressure 5x Rated pressure 
Application temperature-40---+ 125°C 
Storage temperature-55---+ 150°C 
Supply voltage---515V 
Supply current---13mA 

Note:

1. Calculated based on the best-fit curve using the least squares method;

Measured within a temperature range of 2.25℃ to 85℃.

Structural dimensions

The overall chip dimensions are: 1.80 mm × 1.80 mm × 0.7 mm.

Electrical connection

Wheatstone bridgePad NumberPad definition

 

2VS+
3Vout-
5Vs-
6Vout+

Consultation

For inquiries about products or sales, please contact us.

Submit