Pressure chip
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  • Pressure chip

Pressure chip

Product Features ● Small thermal zero drift ● Small temperature hysteresis ● Piezoresistive pressure sensor ● Good long-term stability



Performance metrics

Unless otherwise specified, all the following metrics were measured at 25℃ with a DC 5V power supply.

Parameter Min Typical Max Unit Note
Measurement range --- 40k --- Pa  
Bridge arm resistance 4.7 5.7 6.7  
Zero-point output -50 0 + 50 millivolt  
Full-scale output 60 90 120 millivolt  
Nonlinear 0 0.20 0.30 %FSO 1
Hysteresis under pressure 0 0.05 0.10 %FSO 1
Non-repetitive 0 0.10 0.20 %FSO 1
TCR (Temperature Coefficient of Resistance of Bridge Arm) +0.09 +0.11 +0.13 %R/℃ 2
TCS (Temperature Coefficient of Sensitivity) -0.23 -0.2 -0.17 %FSO/℃ 2
TCO (Zero-Point Temperature Coefficient) -0.05 ±0.03 + 0.05 %FSO/℃ 2
Temperature hysteresis -0.2 --- + 0.2 %FSO 2
Long-term stability -0.2 --- + 0.2 %FSC/year  
Positive Overload Pressure   5x   Rated pressure  
Positive rupture pressure   7x   Rated pressure  
Backside Overload Pressure   3x   Rated pressure  
Backside rupture pressure   5x   Rated pressure  
Application temperature -40 --- + 125 Celsius  
Storage temperature -55 --- + 150 Celsius  
Supply voltage --- 5 15 V  
Supply current --- 1 3 mA  

Note:

1. Calculated by fitting the curve using the least squares method;

Measured within a temperature range of 2.25℃ to 85℃.

Structural dimensions

The overall dimensions of the chip are: 1.80 mm × 1.80 mm × 0.7 mm.

Electrical connection

Wheatstone bridge Pad Number Solder pad setting

 

2 VS+
3 Vout-
5 Vs-
6 Vout+

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