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Pressure chip
Product Model:
HP
Product Features
● Small thermal zero drift
● Small temperature hysteresis
● Piezoresistive pressure sensor
● Excellent long-term stability
Performance Metrics
Unless otherwise specified, all of the following metrics were measured at 25°C with a 5V DC power supply.
| Parameters | Min | Typical | Max | Unit | Note |
| Measurement range | --- | 40k | --- | Pa | |
| Bridge arm resistance | 4.7 | 5.7 | 6.7 | KΩ | |
| Zero-point output | -50 | 0 | + 50 | mV | |
| Full-scale output | 60 | 90 | 120 | mV | |
| Nonlinear | 0 | 0.20 | 0.30 | %FSO | 1 |
| Hysteresis under pressure | 0 | 0.05 | 0.10 | %FSO | 1 |
| Non-repetitive | 0 | 0.10 | 0.20 | %FSO | 1 |
| TCR (Temperature Coefficient of Resistance of Bridge Arms) | +0.09 | +0.11 | +0.13 | %R/℃ | 2 |
| TCS (Temperature Coefficient of Sensitivity) | -0.23 | -0.2 | -0.17 | %FSO/℃ | 2 |
| TCO (Zero-Point Temperature Coefficient) | -0.05 | ±0.03 | + 0.05 | %FSO/℃ | 2 |
| Temperature Hysteresis | -0.2 | --- | + 0.2 | %FSO | 2 |
| Long-term stability | -0.2 | --- | + 0.2 | %FSO/year | |
| Positive Overload Pressure | 5x | Rated pressure | |||
| Positive Burst Pressure | 7x | Rated pressure | |||
| Backside Overpressure | 3x | Rated pressure | |||
| Backside Rupture Pressure | 5x | Rated pressure | |||
| Application temperature | -40 | --- | + 125 | °C | |
| Storage temperature | -55 | --- | + 150 | °C | |
| Supply voltage | --- | 5 | 15 | V | |
| Supply current | --- | 1 | 3 | mA |
Note:
1. Calculated based on the best-fit curve using the least squares method;
Measured within a temperature range of 2.25℃ to 85℃.
Structural dimensions
The overall chip dimensions are: 1.80 mm × 1.80 mm × 0.7 mm.

Electrical connection
| Wheatstone bridge | Pad Number | Pad definition |
| 2 | VS+ |
| 3 | Vout- | |
| 5 | Vs- | |
| 6 | Vout+ |
Consultation
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